Cooler Master HTK-002 heat sink compound 2.37 g

SKU

HTK-002-U1

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$4.73

In stock

HTK-002, 0.8W/mC, 550 volts/mil, 21.7 kV/mm, 2.37g, Grey

For corporate price, please request for quotation at sales@techfable.com.au

Category: Heat Sink Compounds

More Information

More Information
SKU	HTK-002-U1
EAN	0836837001053
Manufacturer	Cooler Master
Availability	Y

Description

Cooler Master HTK-002 thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 177oC (350oF), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.

Specifications

Features
Operating temperature (T-T)	0 - 177 °C
Product colour	Grey
Weight & dimensions
Weight	2.37 g

Technical details
Operating temperature (T-T)	0 - 177 °C
Operational conditions
Operating temperature (T-T)	0 - 177 °C
Colour
Product colour	Grey

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Description	Cooler Master HTK-002 thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 177oC (350oF), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.	Excellent Thermal Conductivity Z3 thermal gel consists of high thermal conductivity to allow high performance heat dissipation. High Compatibility for Most CPU Cooler Density of Z3 is compatible with most polished CPU cooler for maximum heat dissipation. Pure Electrical Insulation Z3 is designed to prevent electrical damage caused by the thermal paste.
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Manufacturer	Cooler Master	Deepcool

Cooler Master HTK-002 heat sink compound 2.37 g

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